Turnkey Solution
With various foundry partners, we provide diversified options of semiconductor manufacturing services to our customers.
The available process technologies include: Bipolar, Mixed-Signal 0.6um~0.13um, Logic 3.0um~0.35um, HV CMOS 2.0um~0.13um, Power Management (BCD) 0.35um~0.18um, Embedded NVM 1.5um~0.15um, Flat-cell process 0.35um~0.45um.
RFCMOS, SiGe, BiCMOS, and CMOS Image Sensors are also obtainable at the customer’s request.
We also have well-experienced engineering and logistic teams to help customers with all the detailed work and communication with FAB. With our service teams, customers could save more time and resources and focus on their project development and marketing.
The available process technologies include: Bipolar, Mixed-Signal 0.6um~0.13um, Logic 3.0um~0.35um, HV CMOS 2.0um~0.13um, Power Management (BCD) 0.35um~0.18um, Embedded NVM 1.5um~0.15um, Flat-cell process 0.35um~0.45um.
RFCMOS, SiGe, BiCMOS, and CMOS Image Sensors are also obtainable at the customer’s request.
We also have well-experienced engineering and logistic teams to help customers with all the detailed work and communication with FAB. With our service teams, customers could save more time and resources and focus on their project development and marketing.
