Product/Service:
ü Wafer Die Saw
üBackside Grinding
üWafer Bumping
ü6"~12" Wafer, Mens, Shuttle dice and die sawing
üDie pick、Tray packaging
üDAF taping & dicing
ü6”~12” wafer backside griding
üGold Bump、Cu/Ni/Au Bump
Product/Service: